PCB Trace Power Handling Calculator

Inputs

Current:

Amps

Thickness:

Optional Inputs

Temperature Rise:

Ambient Temperature:

Trace Length:

Peak Voltage:

Volts

Outputs

Internal Layers

Required Trace Width:

Resistance:

Ω Ohms

Voltage Drop:

Volts

Power Loss:

Watts

External Layers in Air

Required Trace Width:

Resistance:

Ω Ohms

Voltage Drop:

Volts

Power Loss:

Watts

Required Track Clearance

Formulas Used

This design tool is based on the charts in IPC-2221.

First, the Area is calculated:

Area [mils²] = ( Current [Amps] / (k * ( Temp_Rise [°C] )^b) )^(1/c)

Then, the Width is calculated:

Width [mils] = Area [mils²] / ( Thickness [oz] * 1.378 [mils/oz] )

For IPC-2221 internal layers: k = 0.024, b = 0.44, c = 0.725

For IPC-2221 external layers: k = 0.048, b = 0.44, c = 0.725

Note: k, b, and c are constants resulting from curve fitting to the IPC-2221 curves.

The IPC-2221(A) equations are different from those in IPC-D-275 in that they are more conservative and derated to compensate for manufacturing effects.

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PCB Trace Power Handling Calculator

Inputs

Current:

Amps

Thickness:

Optional Inputs

Temperature Rise:

Ambient Temperature:

Trace Length:

Peak Voltage:

Volts

Outputs

Internal Layers

Required Trace Width:

Resistance:

Ω Ohms

Voltage Drop:

Volts

Power Loss:

Watts

External Layers in Air

Required Trace Width:

Resistance:

Ω Ohms

Voltage Drop:

Volts

Power Loss:

Watts

Required Track Clearance

Formulas Used

This design tool is based on the charts in IPC-2221.

First, the Area is calculated:

Area [mils²] = ( Current [Amps] / (k * ( Temp_Rise [°C] )^b) )^(1/c)

Then, the Width is calculated:

Width [mils] = Area [mils²] / ( Thickness [oz] * 1.378 [mils/oz] )

For IPC-2221 internal layers: k = 0.024, b = 0.44, c = 0.725

For IPC-2221 external layers: k = 0.048, b = 0.44, c = 0.725

Note: k, b, and c are constants resulting from curve fitting to the IPC-2221 curves.

The IPC-2221(A) equations are different from those in IPC-D-275 in that they are more conservative and derated to compensate for manufacturing effects.