Advanced Packaging
Qorvo® Elite360℠ Advanced Packaging combines deep RF packaging expertise with a U.S.-based, single-source path from package design through assembly, test and scalable manufacturing.
Advanced Packaging for RF Performance
Packaging is more than a container. It shapes RF performance, thermal efficiency, manufacturability and reliability across the full system. Backed by Qorvo’s Advanced Microwave Module Assembly (AMMA) facility in Richardson, Texas, Elite360 brings package design, U.S.-based assembly and test and scalable manufacturing into one more connected path.
Why Qorvo Advanced Packaging
Qorvo brings together RF packaging expertise, U.S.-based assembly and test, and scalable manufacturing to support defense, radar, communications, 5G and IoT applications from prototype through production.
RF-Centered Design Package choices are optimized for RF, thermal and mechanical performance.
AMMA Execution AMMA supports integrated assembly, packaging and secure manufacturing in Richardson, Texas.
Assembly + Test Together A more connected path from package design through assembly and test helps reduce handoffs.
Prototype to Production Qorvo supports both development work and scalable manufacturing for next-generation RF solutions.
Featured Resources
GaN For Dummies®
Understand GaN technology and the design tradeoffs that impact efficiency, output power and RF performance.
GaN in SATCOM Front-Ends
GaN enables higher RF power density, improved efficiency and reduced size and weight in SATCOM RF front ends.
GaN Thermal Analysis for RF Systems
Characterize GaN thermal behavior through die-level modeling, measurement data and finite element analysis.
Reducing GaN Pulse Recovery Time
Reducing GaN Pulse Recovery Time GaN LNA pulse recovery behavior in EW systems and design approaches to mitigate its effects.
